Holiday
GEN III綜三LRA R2R3R4
Tokyo Electron Technology Introduction. We would like to give an introduction to semiconductor fabrication technologies and what role Tokyo Electron takes in this Industry. In particular, we will explain some basics of Tokyo Electron’s equipment processing technology including oxidation (reviewing various thermal processes), deposition (Chemical Vapor Deposition, Atomic la<x>yer Deposition and Physical Vapor Deposition), dry removal (Plasma etching and Gas Etching), wet cleaning and removal (batch and single wafer, and advanced drying technologies), coater-developer and advanced packaging related technologies. Additionally, we will discuss TEL’s approach to leveraging strengths, aggressive R&D investment, TEL’s focus on the environment and people.
Course keywords: Oxidation, Deposition, Etching, Cleaning, Coating, Developing, Physics, Chemistry ● 課程說明 - Semiconductor Industry: a short introduction - Example: transistor process flow - Equipment and process details: . Oxidation . Deposition . Dry removal . Wet cleaning & removal . Lithography: Coater & Developer . Advanced Packaging - How TEL fits into the semiconductor industry ● 指定用書(Text Books) Non required, course materials will be sent to the students ● 參考書籍(References) Included in the class materials’ powerpoint slides ● 教學方式(Teaching Method) Lecture and possible Training Center visit ● 教學進度(Syllabus) Starting with an introduction to the semiconductor industry, the basic flow of how a semiconductor device is made will be described (as a reference), after which several key technologies will be described in more detail that are directly involved in the semiconductor manufacturing. ● 成績考核(Evaluation) End of class exam or project/presentation
MON | TUE | WED | THU | FRI | |
08:00108:50 | |||||
09:00209:50 | |||||
10:10311:00 | |||||
11:10412:00 | |||||
12:10n13:00 | |||||
13:20514:10 | |||||
14:20615:10 | |||||
15:30716:20 | |||||
16:30817:20 | |||||
17:30918:20 | |||||
18:30a19:20 | |||||
19:30b20:20 | |||||
20:30c21:20 |
Average Percentage 86.27
Std. Deviation 9.25
材料部、製程部選修
-
-
-
-